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Potting & Encapsulating

Potting can ruggedize for extreme environments, provide shock vibration and security of sensitive designs, as well as create a barrier against moisture, fungus, dust, and corrosion. Potting can also enhance circuit reliability by eliminating leakage from high voltage circuits. PRS offers a variety of encapsulants.

Potting with Plasma Ruggedized Solutions means...

• Custom process development
• Both shell enclosures and non-enclosure (dam/fill) applications
• Tin Whisker control
• Ball Grid Array (BGA) underfill (standard and micro)
• FIPS capabilities
• AQMD compliant
• RoHS compliant